Dimensions:        182mm x 182mm±0.5mm

                            With 247mm±0.5mm diameter

Thickness(Si):     180μm±20μm

Front(-):               0.08±0.03mm wide sliver busbars with 16.36mm space

                            Silicon nitride anti-reflection coating

Back(+):              2.1±0.3mm wide silver soldering pads with 16.36mm space

                           Aluminum local back-surface field

Features 

1. Outstanding Power Output per Cell: up to 7.53W

2. Efficiency: up to 22.80%

3. M10 larger size wafers with PERC+SE MBB Smart Technology

4. Superior quality-Color Uniformity,Low Breakage Rate etc

5. Reference cell calibrated from Fraunhofer

6. ISO 9001,ISO 14001 and CQC etc quality systems certificated