Dimensions:        158.75mm x 158.75mm±0.25mm

                            With 223mm±0.25mm diameter

Thickness(Si):     190μm±20μm

Front(-):               0.7mm wide sliver busbars 

                            Silicon nitride anti-reflection coating

Back(+):              1.8mm wide silver soldering pads

                           Aluminum local back-surface field

Features 

1. Outstanding Power Output per Cell: up to 5.67W

2. Efficiency: up to 22.5%

3. G1 larger size wafers with PERC+SE Technology

4. Superior quality-Color Uniformity,Low Breakage Rate etc

5. Reference cell calibrated from Fraunhofer

6. ISO 9001,ISO 14001 and CQC etc certificated