Dimensions:        166mm x 166mm±0.25mm

                            With 223mm±0.25mm diameter

Thickness(Si):     180μm±20μm

Front(-):               0.1±0.02mm wide sliver busbars with 16.80mm/18.00mm space

                            Silicon nitride anti-reflection coating

Back(+):              1.9±0.1mm wide silver soldering pads with 16.80mm/18.00mm space

                           Aluminum local back-surface field

Features 

1. Outstanding Power Output per Cell: up to 6.20W

2. Efficiency: up to 22.60%

3. M6 larger size wafers with PERC+SE MBB Smart Technology

4. Superior quality-Color Uniformity,Low Breakage Rate etc

5. Reference cell calibrated from Fraunhofer

6. ISO 9001,ISO 14001 and CQC etc quality systems certificated